TIE
The INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) contest is a student professional contest whose objective is to promote technological computer aided design (CAE-CAD-CAM) of electronic modules. This contest brings together students from different Universities since 1992. Students have a great opportunity by taking part in this contest. A good organization and a total transparency during the contest are the main coordinates proving professionalism and fair-play among students keen on electronic packaging.
Every year TIE gathers the greatest student PCB designers form around the country in the ultimate showdown in which not only pride and glory are at stake, but also important prizes to be won. At the end of the contest, there can be only one winner, however, all contestants meeting a score margin established by the Industrial Advisor Committee receive a “Certificate of Competence”, recognizing their professional abilities as PCB designers.
Being in close relations with the industry, TIE contestants are widely sought by highly appraised companies for internships and hiring after graduating their studies. As a result, many examples of past TIE contestant can be found in high ranking functions at important companies around the country and around the world, often returning to TIE as part of the “Industrial Advisor Committee”.
TIE not only aims to bring industry and university together, in a tighter, more constant collaboration but under its slogan, „Turn your hobby into a profession!”, also targets to challenge students to think outside of the box, to face them with real-life design challenges and present to them what are the industry’s expectations from an engineering graduate. Therefore, besides the student contest, workshops and presentations held by both foreign universities as well as electronics companies go along with the contest every year.
Sponsors of the contest also get a chance to present their offers and products both to students and committee members, either by exposing roll-ups, banners or even presentation stands or by means of oral presentations. TIE welcomes everyone interested in the field of electronics, PCB design but not only to actively participate in the sponsoring and organizing the contest.
TIE PLUS
TIE+ represents a new contest challenge under the TIE brand, focused on virtual prototyping disciplines that support high-complexity PCB design. TIE+ will be implemented as an individual challenge, managed using an online platform, nevertheless contestants will have to present their subject solutions in a live face-to-face meeting in front of the technical committee.
The TIE+ concept emerged as a “natural” step forward in the support and promotion of PCB design competence in the Romanian (mainly, but not restricted to) electronics professional environment.
As a response to the highly increasing market demand for PCB design professionals to have also expertise in fields like signal integrity, thermal management and EMC, the TIE steering and technical committees decided to add a “plus” to the current TIE event by incorporating also the area of virtual prototyping .
The brief list of the TIE+ objectives would be:
1. The promotion of simulation based PCB design disciplines in universities and company based R&D centers
2. Stimulating the development of future specialist in the field of interconnect simulations in accordance to best-in-class companies demands
3. Create a collaborative-competitive environment where the candidates presents their technical solutions, but also exchange ideas on simulation approaches and get in touch other PCB design professionals
For more information please see the official page of TIE & TIE+: www.tie.ro
