International Symposium for Design and Technology in Electronic Packaging (SIITME) 2026
The organising committee of SIITME 2026 kindly invites you to submit an abstract/paper to the 2026 IEEE 32nd International Symposium for Design and Technology in Electronic Packaging (SIITME), organized in Târgoviște, Romania. The scientific event will be held on October 28th–31st, 2026.
Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document and as PDF document, using the SIITME Conference Management System. The Microsoft CMT service was used for managing the peer-reviewing process for this conference. This service was provided for free by Microsoft and they bore all expenses, including costs for Azure cloud services as well as for software development and support.
Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
More information on SIITME website.
