International Symposium for Design and Technology in Electronic Packaging (SIITME) 2024
The organising committee of SIITME 2024 kindly invites you to submit an abstract/paper to the 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME), organized in Sibiu, Romania. The scientific event will be held on October 16th–18th, 2024.
Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
More information on SIITME website.
